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AD产品 - HMC606-Die介绍

HMC606-Die - Wideband Low Phase Noise Amplifier Chip, 2 - 18 GHz

HMC606-Die是AD公司的一款宽带分布式放大器产品，HMC606-Die是Wideband Low Phase Noise Amplifier Chip, 2 - 18 GHz，本站介绍了HMC606-Die的封装应用图解、特点和优点、功能等，并给出了与HMC606-Die相关的AD元器件型号供参考。

HMC606-Die - Wideband Low Phase Noise Amplifier Chip, 2 - 18 GHz - 宽带分布式放大器 - 放大器 - Analog Devices

产品描述

The HMC606 is a GaAs InGaP HBT MMIC Distributed Amplifier die which operates between 2 and 18 GHz. With an input signal of 12 GHz, the amplifier provides ultra low phase noise perfor-mance of -160 dBc/Hz at 10 kHz offset, representing a significant improvement over FET-based distributed amplifiers.

The HMC606 provides 14 dB of small signal gain, +27 dBm output IP3 and +15 dBm of output powe at 1 dB gain compression which requiring 64 mA from a +5V supply. The HMC606 amplifier I/O's are internally mateched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is taken with the chip in a 50 Ohm test fixture connected via 0.025 mm (1mil) diameter wire bonds of minimal length 0.31 mm (12 mil).


Applications

  • Radar, EW & ECM
  • Microwave Radio
  • Test Instrumentation
  • Military & Space
  • Fiber Optic Systems
    • 优势和特点
  • Ultra Low Phase Noise: -160 dBc/Hz @ 10 kHz
  • P1dB Output Power: +15 dBm
  • Gain: 14 dB
  • Output IP3: +27 dBm
  • Supply Voltage: +5V @64mA
  • 50 Ohm Matched Input/Output
  • Die Size: 2.11 x 1.32 x 0.10 mm
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